H₂ Diffraction from a Strained Pseudomorphic Monolayer of Cu Deposited on Ru(0001)DIAZ, C; MARTIN, F; KROES, G. J et al.Journal of physical chemistry. C. 2012, Vol 116, Num 25, pp 13671-13678, issn 1932-7447, 8 p.Article

Effects of multi-layer graphene capping on Cu interconnectsCHANG GOO KANG; SUNG KWAN LIM; HAM, Moon-Ho et al.Nanotechnology (Bristol. Print). 2013, Vol 24, Num 11, issn 0957-4484, 115707.1-115707.5Article

Water Chains Guide the Growth of Monoatomic Copper Wires on Cu(110)YU SHI; CHOI, Byoung Y; SALMERON, Miquel et al.Journal of physical chemistry. C. 2013, Vol 117, Num 33, pp 17119-17122, issn 1932-7447, 4 p.Article

Probing Absolute Spin Polarization at the NanoscaleELTSCHKA, Matthias; JÄCK, Berthold; ASSIG, Maximilian et al.Nano letters (Print). 2014, Vol 14, Num 12, pp 7171-7174, issn 1530-6984, 4 p.Article

Adsorption Behavior of Methimazole Monolayers on a Copper Surface and Its Corrosion InhibitionPAN, Ying-Cheng; YING WEN; XUE, Lu-Yuan et al.Journal of physical chemistry. C. 2012, Vol 116, Num 5, pp 3532-3538, issn 1932-7447, 7 p.Article

Metal-Supported Metal Clusters: A Density Functional Study of Pt₃ and Pd₃SANTANA, Juan A; RÖSCH, Notker.Journal of physical chemistry. C. 2012, Vol 116, Num 18, pp 10057-10063, issn 1932-7447, 7 p.Article

Source Truncation and Exhaustion: Insights from Quantitative in situ TEM Tensile TestingKIENER, D; MINOR, A. M.Nano letters (Print). 2011, Vol 11, Num 9, pp 3816-3820, issn 1530-6984, 5 p.Article

Copper nanoparticles and organometallic chemical liquid deposition (OMCLD) for substrate metallizationBARRIERE, Clément; ALCARAZ, Gilles; MARGEAT, Olivier et al.Journal of material chemistry. 2008, Vol 18, Num 26, pp 3084-3086, issn 0959-9428, 3 p.Article

CO Adsorption Behavior of Cu/SiO₂, Co/SiO₂, and CuCo/SiO₂ Catalysts Studied by in Situ DRIFTSSMITH, Miranda L; KUMAR, Nitin; SPIVEY, James J et al.Journal of physical chemistry. C. 2012, Vol 116, Num 14, pp 7931-7939, issn 1932-7447, 9 p.Article

Catalytic Reactivity of CuNi Alloys toward H₂O and CO Dissociation for an Efficient Water-Gas Shift: A DFT StudyGAN, Li-Yong; TIAN, Ren-Yu; YANG, Xiao-Bao et al.Journal of physical chemistry. C. 2012, Vol 116, Num 1, pp 745-752, issn 1932-7447, 8 p.Article

Effects of segregated Cu on an Fe grain boundary by first-principles tensile testsYUASA, Motohiro; MABUCHI, Mamoru.Journal of physics. Condensed matter (Print). 2010, Vol 22, Num 50, issn 0953-8984, 505705.1-505705.7Article

Divide and Protect: Passivating Cu(111) by Cu-(benzotriazole)₂XI CHEN; HÄKKINEN, Hannu.Journal of physical chemistry. C. 2012, Vol 116, Num 42, pp 22346-22349, issn 1932-7447, 4 p.Article

Effect of copper concentration in printable copper inks on film fabricationSUK JUN KIM; LEE, Jaeho; CHOI, Yun-Hyuk et al.Thin solid films. 2012, Vol 520, Num 7, pp 2731-2734, issn 0040-6090, 4 p.Article

Preparation of 1-pyrenebutyric acid and pyrene submicron dots by laser-induced molecular micro-jet implantationPIHOSH, Y; GOTO, M; KASAHARA, A et al.Thin solid films. 2009, Vol 518, Num 2, pp 896-900, issn 0040-6090, 5 p.Conference Paper

Contrast Formation in Kelvin Probe Force Microscopy of Single π-Conjugated MoleculesSCHULER, Bruno; LIU, Shi-Xia; YAN GENG et al.Nano letters (Print). 2014, Vol 14, Num 6, pp 3342-3346, issn 1530-6984, 5 p.Article

Direct Measurement of Adhesion Energy of Monolayer Graphene AsGrown on Copper and Its Application to Renewable Transfer ProcessYOON, Taeshik; WOO CHEOL SHIN; TAEK YONG KIM et al.Nano letters (Print). 2012, Vol 12, Num 3, pp 1448-1452, issn 1530-6984, 5 p.Article

Large Physisorption Strain in Chemical Vapor Deposition of Graphene on Copper SubstratesRUI HE; LIUYAN ZHAO; PETRONE, Nicholas et al.Nano letters (Print). 2012, Vol 12, Num 5, pp 2408-2413, issn 1530-6984, 6 p.Article

SO₂ Decomposition on Pt/CeO₂(111) Model Catalysts: On the Reaction Mechanism and the Influence of H₂ and COHAPPEL, Markus; LYKHACH, Yaroslava; TSUD, Nataliya et al.Journal of physical chemistry. C. 2012, Vol 116, Num 20, pp 10959-10967, issn 1932-7447, 9 p.Article

Directly electrospun ultrafine nanofibres with Cu grid spinneretWENWANG LI; GAOFENG ZHENG; XIANG WANG et al.Journal of physics. D, Applied physics (Print). 2011, Vol 44, Num 13, issn 0022-3727, 135502.1-135502.8Article

Programming resistive switching memory by a charged capacitorSEN ZHANG; QI LIU; MING LIU et al.Applied physics. A, Materials science & processing (Print). 2011, Vol 102, Num 4, pp 1003-1007, issn 0947-8396, 5 p.Article

Recovery of electrical resistance in copper films on polyethylene terephthalate subjected to a tensile strainGLUSHKO, O; MARX, V. M; KIRCHLECHNER, C et al.Thin solid films. 2014, Vol 552, pp 141-145, issn 0040-6090, 5 p.Article

The orientation relationships of the Cu₃Sn/Cu interfaces and a discussion of the formation sequence of Cu₃Sn and Cu₆Sn₅WANG, Kuang-Kuo; DERSHIN GAN; HSIEH, Ker-Chang et al.Thin solid films. 2014, Vol 562, pp 398-404, issn 0040-6090, 7 p.Article

Development and Status of Cu Ball/Wedge Bonding in 2012SCHNEIDER-RAMELOW, Martin; GEISSLER, Ute; SCHMITZ, Stefan et al.Journal of electronic materials. 2013, Vol 42, Num 3, pp 558-595, issn 0361-5235, 38 p.Article

Electroreduction of Carbon Dioxide to Methane on Copper, Copper― Silver, and Copper―Gold Catalysts: A DFT StudyHIRUNSIT, Pussana.Journal of physical chemistry. C. 2013, Vol 117, Num 16, pp 8262-8268, issn 1932-7447, 7 p.Article

Friction force microscopy: a simple technique for identifying graphene on rough substrates and mapping the orientation of graphene grains on copperMARSDEN, A. J; PHILLIPS, M; WILSON, N. R et al.Nanotechnology (Bristol. Print). 2013, Vol 24, Num 25, issn 0957-4484, 255704.1-255704.9Article